Taipei, 30 July 2026 – ASE Technology has increased its 2026 capital expenditure plan by US$2 billion as demand for advanced chip packaging and testing accelerates. The decision positions the Taiwanese group to capture a larger share of artificial-intelligence infrastructure spending, while raising the stakes for utilisation and returns on a rapidly expanding asset base.

Advanced packaging has become a critical bottleneck because high-performance processors rely on sophisticated methods to connect compute, memory and power efficiently. As chip designers push larger and more complex systems, outsourced assembly and testing providers gain strategic importance. ASE’s spending signals confidence that customer demand will extend beyond a short product cycle.