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Samsung and Broadcom Forge US$200 Billion AI Chip Partnership

San Francisco, 25 July 2026 – Samsung Electronics and Broadcom have agreed to pursue more than US$200 billion in strategic cooperation over the next five years, deepening their partnership across memory chips, semiconductor manufacturing and advanced packaging for next-generation artificial intelligence infrastructure.

The memorandum of understanding, extending through 2030, was unveiled during an AI summit in San Francisco attended by senior executives from both companies and representatives of the South Korean government. The agreement positions Samsung as a major integrated supplier to Broadcom as demand for customised AI accelerators and high-performance computing components continues to rise.

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  • Steven is a writer focused on science and technology, with a keen eye on artificial intelligence, emerging software trends, and the innovations shaping our digital future.

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