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Friday, 7 August 2026

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EcoSys Signs Underwriting Agreement for RM39.34 Million ACE Market IPO

By Abigail Cheong3 min read

Kuala Lumpur, 6 August 2026 – EcoSys (Malaysia) Berhad has signed an underwriting agreement with M & A Securities Sdn Bhd for its proposed listing on Bursa Malaysia’s ACE Market, advancing plans to raise approximately RM39.34 million for expansion, debt repayment and operational investment.

The pan-semiconductor industrial-solutions provider intends to issue 145.70 million new shares, representing approximately 25.5% of its enlarged issued share capital of 571.35 million shares after listing. The offering contains no sale of existing shares, meaning the gross proceeds will be raised entirely for the company rather than paid to current shareholders.

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Author

  • I am Abigail, a journalist at The Ledger Asia, covering business and finance with a focus on the Malaysian Stock Market and key economic developments across Asia. Known for clear, accessible reporting, I deliver insights that help readers understand market trends, corporate movements, and regional news shaping the Asian economy.