Tokyo, 23 September 2026 – SoftBank Group has begun marketing a large high-yield bond offering as it seeks more capital for artificial-intelligence investments, testing how much debt investors will accept in exchange for exposure to the sector’s growth. The proposed transaction could raise the equivalent of more than US$11 billion, including about US$10 billion in dollar notes and a €1 billion euro portion, but the terms remain preliminary.
Initial guidance on the dollar tranches indicates yields of 8.75% to 8.875% for roughly 3.5-year notes, 9.375% to 9.5% for about 5.5-year securities and 9.75% to 9.875% for a longer tranche. The reported dollar allocations are US$1 billion, US$4.5 billion and US$4.5 billion respectively. Final maturities, yields and proceeds can change during bookbuilding, so indicative numbers should not be presented as a completed financing result.
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