Shanghai, 18 September 2026 – Huawei has advanced its Ascend 960 chip roadmap and unveiled the Atlas 960E SuperPoD, positioning integrated computing systems as a central part of its AI strategy. The announcements shift attention beyond an individual accelerator’s specifications toward the coordination of processing, memory and interconnect across a large deployment.
At HUAWEI CONNECT, the company said Ascend 960DT would be available in the first quarter of 2027, three quarters ahead of its original plan, while Ascend 960PR would be ready in the third quarter. It also outlined Ascend 970 and 980 launches for 2028 and 2029. These are company roadmap statements, not confirmation that the future chips are already commercially deployed.
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