Redmond, Washington, 10 August 2026 – Technology giant Microsoft is preparing a major production increase for its custom-designed artificial intelligence chips, expanding negotiations with semiconductor foundries to secure hundreds of thousands of next-generation accelerators as cloud giants accelerate efforts to lower computing costs and reduce reliance on external chip suppliers.
According to technology trade disclosures released on Monday, Microsoft plans to unveil its next-generation Maia 300 AI chip as early as September 2026. As part of its expanded hardware strategy, the software leader is negotiating with Taiwan Semiconductor Manufacturing Company (TSMC) to secure wafer fabrication capacity for over 300,000 Maia units, with initial commercial deliveries scheduled to begin in 2027.
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