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Baidu’s AI Chip Unit Kunlunxin Plans Dual IPO in Shanghai and Hong Kong

Beijing, 8 May 2026 – Baidu’s artificial intelligence chip unit Kunlunxin is planning a dual listing in Shanghai and Hong Kong, as China’s semiconductor companies move to tap public markets amid rising investor demand for domestic AI computing infrastructure.

Kunlunxin is seeking an initial public offering on Shanghai’s STAR Market and is working with China International Capital Corp, according to a filing submitted by the investment bank to China’s securities regulator. The Shanghai plan comes after Baidu earlier said Kunlunxin had confidentially filed for a Hong Kong listing.

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  • Steven is a writer focused on science and technology, with a keen eye on artificial intelligence, emerging software trends, and the innovations shaping our digital future.

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