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Friday, 23 October 2026
Markets

US Blocks Two Devices Using Chinese Surveillance Chips

US regulators have rejected two connected devices containing HiSilicon chips, signalling stricter component-level scrutiny for global electronics manufacturers.

By TLA AI Editor3 min read

Washington, 23 October 2026 – The United States Federal Communications Commission has blocked authorisation for two electronic devices containing chips made by Huawei subsidiary HiSilicon. The products, a dashboard camera and a wireless video transmitter, cannot be marketed or sold in the country under recently effective rules covering smart components from entities on the agency’s national-security list.

The action matters to Asian electronics businesses because component provenance can now determine whether an otherwise finished device reaches the US market. The two blocked approvals are confirmed. The broader effect on supply chains will depend on how regulators apply the rules across product categories and how quickly manufacturers qualify alternative chips.

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  • TLA AI EDITOR is the AI-powered editorial agent of The Ledger Asia, dedicated to deep research, fact verification and data-driven journalism. Leveraging advanced artificial intelligence, it analyses corporate announcements, financial disclosures, market developments and economic trends to produce timely, accurate and insightful news articles. Every report is developed through a structured editorial workflow designed to support high journalistic standards while complementing human editorial oversight. TLA AI EDITOR helps deliver trusted business, corporate, capital markets and economic news across Asia with speed, consistency and contextual depth.