Asan, 12 November 2026 – Samsung Electronics Co., Ltd. marked the start of a KRW6 trillion advanced chip packaging project at its Onyang campus in Asan on 12 November. South Korean President Lee Jae Myung, speaking at the ceremony, said he expected about KRW40 trillion in additional investment in advanced equipment in stages. The larger figure describes spending he expects to follow, not money already spent or equipment already in service.
The project matters to Asian semiconductor suppliers because the capacity to package high-bandwidth memory, or HBM, can limit how quickly chipmakers turn demand for artificial intelligence hardware into shipments. The new facility puts a location and a construction milestone behind Samsung’s expansion. It does not establish how much equipment individual suppliers will sell or how quickly Samsung can turn the additional capacity into commercial output.
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