Kuala Lumpur / The Hague, September 6, 2025 — Malaysia and the Netherlands have formalized a landmark Memorandum of Cooperation (MoC)—a strategic move aimed at deepening collaboration in the semiconductor sector. Signed in The Hague by Malaysia’s Investment, Trade and Industry Minister, Tengku Datuk Seri Zafrul Abdul Aziz, and the Netherlands’ Minister of Economic Affairs, Vincent Karremans, the agreement marks a critical milestone in both countries’ ambitions to reinforce their positions in the global chip ecosystem.
The MoC aligns closely with Malaysia’s National Semiconductor Strategy (NSS), which targets RM500 billion in investments, the establishment of high-value local chip companies, and the training of 60,000 engineers by 2030. Through this pact, Malaysia will harness Dutch expertise in advanced chipmaking to elevate its strengths in assembly, testing, and packaging, while preparing to scale up the value chain over time.
A notable feature of the agreement is the establishment of the Annual Malaysia–Netherlands Semiconductor Dialogue, which will serve as a structured forum for reviewing collaborative projects, aligning policymaking, and sharing intelligence on market trends, talent development, R&D, and technology exchange.
This partnership underscores both nations’ intentions to diversify and strengthen semiconductor supply chains—an increasingly pressing priority amid geopolitical volatility and tech nationalism. For Malaysia, the collaboration promises to enhance the resilience and sophistication of its semiconductor ecosystem, while positioning it as a competitive hub in the region. For the Netherlands, it paves the way to extend its technological leadership, especially in high-end manufacturing and innovation.
