Beijing, 24 August 2026 – Xiaomi has unveiled its latest internally designed smartphone processor, the XRING O3, marking another significant step in the Chinese technology group’s effort to control more of the hardware powering its premium devices.
The new system-on-chip will be manufactured by Taiwan Semiconductor Manufacturing Company using advanced three-nanometre technology, according to people familiar with the production plans. It is expected to debut in an upcoming flagship foldable smartphone, with initial shipments targeted at between 200,000 and 300,000 units.
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