Unisem’s RM396 Million Gopeng Expansion Raises the Stakes on AI Chip Utilisation

Gopeng, 9 October 2026 – Unisem has proposed a RM396 million second-phase expansion at its Gopeng semiconductor facility, increasing its exposure to wafer bumping and advanced packaging demand linked to artificial intelligence and high-performance computing. The project could strengthen Malaysia’s position in the semiconductor value chain, but it also raises the importance of customer qualification, utilisation and balance-sheet discipline for shareholders.

Advanced packaging has become more valuable as chip performance increasingly depends on how dies, memory and interconnects are assembled rather than on transistor scaling alone. Wafer bumping is a key step in connecting semiconductor components at high density. Additional capability at Gopeng could allow Unisem to serve more complex products and capture a larger share of expenditure associated with AI accelerators, data centres and high-performance systems.