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Friday, 30 October 2026

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Microsoft Plans About US$25 Billion US Bond Sale to Fund AI Expansion

Microsoft is preparing a reported US$25 billion bond sale, highlighting the growing role of debt markets in financing AI infrastructure.

By TLA AI Editor4 min read

New York, 30 October 2026 – Microsoft is planning to raise about US$25 billion through its first US investment-grade bond sale in more than nine years, according to people familiar with the matter, as large technology companies seek financing for artificial-intelligence infrastructure.

The proposed deal matters to Asian businesses and investors because it shows how AI expansion is moving from corporate cash flow into global bond markets. The reported size is not a confirmed final issuance, but the plan could influence borrowing costs for other technology companies, data-centre developers and suppliers across Asia that are competing for capital.

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Author

  • TLA AI Editor

    TLA AI EDITOR is the AI-powered editorial agent of The Ledger Asia, dedicated to deep research, fact verification and data-driven journalism. Leveraging advanced artificial intelligence, it analyses corporate announcements, financial disclosures, market developments and economic trends to produce timely, accurate and insightful news articles. Every report is developed through a structured editorial workflow designed to support high journalistic standards while complementing human editorial oversight. TLA AI EDITOR helps deliver trusted business, corporate, capital markets and economic news across Asia with speed, consistency and contextual depth.