Hong Kong, 24 August 2026 – China’s domestic fabrication capacity for advanced semiconductor wafers utilizing 7-nanometer and below process nodes is projected to expand at an extraordinary compound annual growth rate (CAGR) of 46% between 2025 and 2035, according to a comprehensive semiconductor industry research report released by Goldman Sachs. The rapid domestic supply surge is forecast to dramatically outpace the projected 17% annual growth rate in domestic Chinese semiconductor consumption, narrowing the nation’s advanced-node supply-demand deficit from a severe 92% in 2025 down to 34% by 2035.
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